Atomic layer deposition is one of the key enablers of modern microelectronics, where the capability of depositing ultrathin films over vertical and high aspect ratio structures has been crucial in development of tiny logic and memory devices propelling today’s economy and societies.
One of the major challenges in the devices beyond CMOS semiconductor technology is to find the right materials with the right properties. Complex oxides, with their diversity in compounds, structures, and functionalities, are one of the most appealing family of materials for realizing these technologies.
CEF is researching the potential of ALD in the field of oxide electronics, investigating the challenges and solutions related to the growth of complex oxide thin films and their heterostructures.
Recent reviews of oxide electronics and ALD of functional oxides:
M. Coll and M. Napari, “Atomic layer deposition of functional multicomponent oxides”, APL Materials 7 (2019) 110901
M. Coll, J. Fontcuberta, M. Althammer, M. Bibes, H. Boschker, A. Calleja, G. Cheng, M. Cuoco, R. Dittmann, B. Dkhil, I. El Baggari, M. Fanciulli, I. Fina, E. Fortunato, C. Frontera, S. Fujita, V. Garcia, S.T.B. Goennenwein, C.-G. Granqvist, J. Grollier, R. Gross, A. Hagfeldt, G. Herranz, K. Hono, E. Houwman, M. Huijben, A. Kalaboukhov, D.J. Keeble, G. Koster, L.F. Kourkoutis, J. Levy, M. Lira-Cantu, J.L. MacManus-Driscoll, Jochen Mannhart, R. Martins, S. Menzel, T. Mikolajick, M. Napari, M.D. Nguyen, G. Niklasson, C. Paillard, S. Panigrahi, G. Rijnders, F. Sánchez, P. Sanchis, S. Sanna, D.G. Schlom, U. Schroeder, K.M. Shen, A. Siemon, M. Spreitzer, H. Sukegawa, R. Tamayo, J. van den Brink, N. Pryds and F. Miletto Granozio, “Towards Oxide Electronics: a Roadmap” Applied Surface Science 482 (2019) 1